{"identifier":"nobleid:/w1/20260521/2DCDF43C","arkIdentifier":"ark:/48914/w1/20260521/2DCDF43C","version":1,"workTitle":"Electromigration instability: Transgranular slits in interconnects","workType":"Journal Article","authors":"Zhigang Suo, W. Wang, Muwen Yang","description":null,"workUrl":null,"existingDoi":"10.1063/1.111750","createdAt":"2026-05-21T17:34:18.541613Z","canonicalUrl":"https://nobleid.org/ark:/48914/w1/20260521/2DCDF43C.v1"}