{"identifier":"nobleid:/w1/20260521/AF5F93BC","arkIdentifier":"ark:/48914/w1/20260521/AF5F93BC","version":1,"workTitle":"<title>Bondability of processed glass wafers</title>","workType":"Conference Paper","authors":"G. Pandraud, Chengqun Gui, Florent Pigeon, Paul Lambeck, Ο. Parriaux","description":null,"workUrl":null,"existingDoi":"10.1117/12.364303","createdAt":"2026-05-21T12:27:24.695652Z","canonicalUrl":"https://nobleid.org/ark:/48914/w1/20260521/AF5F93BC.v1"}