{"identifier":"nobleid:/w1/20260521/BBD07DBB","arkIdentifier":"ark:/48914/w1/20260521/BBD07DBB","version":1,"workTitle":"107 Thermal history dependence of the mechanical properties of electroplated copper thin films","workType":"Conference Paper","authors":"Fumiaki Endo, Naokazu Murata, Ken Suzuki, Hideo Miura","description":null,"workUrl":null,"existingDoi":"10.1299/jsmetohoku.2010.46.13","createdAt":"2026-05-21T13:24:11.775662Z","canonicalUrl":"https://nobleid.org/ark:/48914/w1/20260521/BBD07DBB.v1"}