{"identifier":"nobleid:/w1/20260521/DBB7937D","arkIdentifier":"ark:/48914/w1/20260521/DBB7937D","version":1,"workTitle":"Highly reliable photoimageable dielectric resins for wafer level CSP redistribution","workType":"Journal Article","authors":"Ciro Esposito, E. Yamayoshi, M. Yonehara, K. Arao, K. Yoshida, Shenghua Li, Masaki Kondoh","description":null,"workUrl":null,"existingDoi":"10.1109/iemt.2003.1225894","createdAt":"2026-05-21T19:23:27.106272Z","canonicalUrl":"https://nobleid.org/ark:/48914/w1/20260521/DBB7937D.v1"}