{"identifier":"nobleid:/w1/20260521/EB4EB678","arkIdentifier":"ark:/48914/w1/20260521/EB4EB678","version":1,"workTitle":"Metal foams as novel compact high performance heat exchangers for the coolig of electronics","workType":"Journal Article","authors":"Kevin Boomsma","description":null,"workUrl":null,"existingDoi":"10.3929/ethz-a-004469526","createdAt":"2026-05-21T20:23:16.024468Z","canonicalUrl":"https://nobleid.org/ark:/48914/w1/20260521/EB4EB678.v1"}