{"identifier":"nobleid:/w1/20260521/ECACBA33","arkIdentifier":"ark:/48914/w1/20260521/ECACBA33","version":1,"workTitle":"Anand model and FEM analysis of SnAgCuZn lead-free solder joints in wafer level chip scale packaging devices","workType":"Journal Article","authors":"Liang Zhang, Jiguang Han, Yonghuan Guo, Chengwen He","description":null,"workUrl":null,"existingDoi":"10.1016/j.microrel.2013.07.100","createdAt":"2026-05-21T14:16:51.636690Z","canonicalUrl":"https://nobleid.org/ark:/48914/w1/20260521/ECACBA33.v1"}