{"identifier":"nobleid:/w1/20260525/C96BC9DA","arkIdentifier":"ark:/48914/w1/20260525/C96BC9DA","version":1,"workTitle":"Correlation of Postetch Residues to Deposition Temperature in Plasma Etched Aluminum Alloys","workType":"Journal Article","authors":"Tim Abraham","description":null,"workUrl":null,"existingDoi":"10.1149/1.2100293","createdAt":"2026-05-25T17:30:10.963115Z","canonicalUrl":"https://nobleid.org/ark:/48914/w1/20260525/C96BC9DA.v1"}