{"identifier":"nobleid:/w1/20260525/EB9ECA44","arkIdentifier":"ark:/48914/w1/20260525/EB9ECA44","version":1,"workTitle":"Materials Issues in Hermetic Wafer Level Packaging Using Au Thermocompression and Au-Sn Transient Liquid Phase Bonding","workType":"Journal Article","authors":"Dany Chagnon, Dilek Işık, Pierre L. Lévesque, François Lewis, Marie-Ève Caza, Xuan Tuan Le, Jean-Sébastien Poirier, Damien Michel, Ronan Larger, Oussama Moutanabbir","description":null,"workUrl":null,"existingDoi":"10.1149/ma2014-02/34/1741","createdAt":"2026-05-25T04:19:00.703972Z","canonicalUrl":"https://nobleid.org/ark:/48914/w1/20260525/EB9ECA44.v1"}