Development and evaluation of SiC inverter using Ni micro plating bonding power module

Akihiro Kawagoe; Tomoya Itose; Akihiro Imakiire; Masahiro Kozako; Masayuki Hikita; Kohei Tatsumi; Tomonori Iizuka; Isamu Morisako; Nobuaki Sato; Kōji Shimizu

doi:10.1109/iwipp.2019.8799079

Development and evaluation of SiC inverter using Ni micro plating bonding power module

Identifier:nobleid.org/w1/20260515/814ACE4F

Type:Journal Article

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Development and evaluation of SiC inverter using Ni micro plating bonding power module

Identifier:nobleid.org/w1/20260515/814ACE4F

Type:Journal Article

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